Lall, P., Deshpande, S., Nguyen, L., Prognostication of Cu-Al WB System Subjected to High Temperature-Humidity Condition, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. Lall, P., Deshpande, S., Nguyen, L., ANN Based RUL Assessment for Copper-Aluminum Wirebonds Subjected to Harsh Environments, Proceedings of the IEEE 2016 International Conference on Prognostics and Health Management (ICPHM2016), Ottawa, ON, pp. Lall, P., Zhang, H., Prognostication of Remaining Useful-Life for Flexible Batteries in Foldable Wearable Electronics, Proceedings of the IEEE 2016 International Conference on Prognostics and Health Management (ICPHM2016), Ottawa, ON, pp. Lall, P., Thomas, T., Lall, P., Zhang, H., Prognostication of Remaining Useful-Life for Flexible Batteries in Foldable Wearable Electronics, in Proceedings of the 2019 IEEE 18th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. Lall, P., Thomas, T., Blecker, K., Health monitoring and feature vector identification of failure for SAC305 Solder PCBs under shock loads up to 10,000g, in Proceedings of the 2020 IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. Lall, P., Thomas, T., Blecker, K., Feature Vector Identification and Prognostics of SAC305 PCBs for Varying G-Levels of Drop and Shock Loads, in Proceedings of the 2021 IEEE 20th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. Lall, P., Thomas, T., Blecker, K., Prognostic and RUL Estimations of SAC105, SAC305 and SnPb Solders under Different Drop and Shock Loads using Long Short-Term Memory (LSTM) Deep Learning Technique, in Proceedings of the 2021 IEEE 20th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. PHM will enable self-cognizant systems capable of assessing their own real-time performance under actual usage conditions and adaptively trigger risk mitigation actions to virtually eliminate unplanned failures. Decision support for re-deployment requires PHM-based methods for assessment of the operational readiness of electronic systems, which is based on accrued damage and residual life in the intended environment. Thermal environments may change due to operational factors or changes in usage profiles. Deployed electronic systems often may be subjected to multiple thermal environments. Implantable biological systems are often life sustaining in nature. Automotive safety features such as anti-lock braking, airbags, and collision avoidance systems depend on the electronics utilized for their performance and reliability. Avionic systems require ultra-high reliability operation with minimal downtime. PHM has been applied to machines, aircrafts, bridges, electronics, and bio-implantable systems. Early warnings may be used to forecast planned maintenance and assess the potential for life extensions. Recently, PHM has emerged as a key enabling technology for providing an early warning of failure. Prognostics Health Management is very different from reliability prediction, which often assumes pristine materials and uses models that require definitive specification of environmental loads.įigure 1: Approach for PHM for Thermo-mechanics, Shock and Vibration Environments The prior stress history to which the system may have been subjected may not be known in several cases. System health is generally assessed in the actual operating environment. Prognostics Health Management (PHM) is the interrogation of system state and the assessment of product survivability in deployed systems using non-destructive assessment of underlying damage. Prognostic Health Management for Electronics Prognostic Health Management for Electronics
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